Abstract: Thermomechanical stress induced by through-silicon vias (TSVs) plays an important role in the performance and reliability analysis of 2.5D/3D ICs. While the finite element method (FEM) ...

Abstract: In this paper, we demonstrated a multi-scale thermal modeling work for 3D-heterogeneous integrated processing-near-memory (PNM) chips. To achieve this, We extracted thermal conductivity ...